Technological selection
We take into account the substrate, recommended application temperature range, open time and expected bond strength.
Safe connection of packaging
We select hot melt adhesives for folding, closing and stabilizing packaging, taking into account the material, line speed and conditions of use of the finished product.

Selection for the application
Stable and durable connection
Technological support
Solutions tailored to your needs
Properly selected hot melt helps maintain stable production, rational consumption and the expected quality of the weld. We analyze the substrate, the application device and the conditions in which the packaging will be stored and transported.
We take into account the substrate, recommended application temperature range, open time and expected bond strength.
Solutions for gluing boxes, trays, displays and other cardboard structures.
We help reduce unnecessary glue consumption and maintain repeatable quality on the line.
Fast setting in industrial processes
The packaging joint should withstand folding, filling, storage and transport. However, not every adhesive behaves the same on different surfaces and at different temperatures. Therefore, the choice of hot melt should result from the analysis of the entire application, and not only from the price of the product.
Connecting flaps and elements of boxes, trays and shaped structures on automatic lines.
Quick welding during packaging and preparation of the product for shipment.
Stabilizing several unit packages into a collective package at a later stage of logistics.
Controlled limitation of carton movement, if the product technology provides for such an application.
From granules to the finished joint
Hot melt adhesive is heated in an application device, applied in a liquid state to the selected surface, and then connects the elements while cooling. The short setting time makes the technology fit well into quick packaging folding and closing processes.
The properties of the adhesive can be built on various polymer bases, including EVA or polyolefin. The formula also contains ingredients responsible for viscosity, adhesion, thermal stability and behavior of the joint under set conditions. However, the type of polymer itself is not sufficient to assess the suitability of the product.
The application temperature is not one constant value for all hot melts. It should be set in accordance with the technical data sheet of the specific adhesive and the requirements of the application system. Temperatures that are too low or too high may impair application, increase wear or lead to bond quality problems.
Cardboard is not always the same substrate
Two boards with a similar appearance may differ in absorbency, finish and surface energy. Printing, varnish or coating may change adhesion, therefore tests should be performed on material corresponding to subsequent series production.
The path of the packaging after gluing is also important. A carton stored in standard conditions may require different properties than a tray or package placed in a cold store or freezer. We evaluate not only the initial bond, but also the behavior of the joint over time and within the expected temperature range.
Stable application and repeatable joint
The weld achieves adhesion appropriate to the material, structure and loads occurring in the process.
Proper formulation and proper settings can reduce threading, deposits and application downtime.
The holding time is adjusted to the line speed, the pressing length and the moment of passing the package on.
Selecting the dose and application pattern allows you to obtain the required joint without applying excessive amounts of glue.
Analysis and testing instead of guessing
We start with information about the glued materials, the packaging design, the current device and the problem to be solved. We determine the process speed, temperatures, open time and pressure, as well as the conditions occurring after leaving the line.
Application tests allow you to verify surface wetting, initial grip and joint strength. Depending on the application, the assessment may include mechanical tests and checking the behavior of the connection at elevated or lower temperatures, in humidity or after a specified period of storage.
After implementation, we check the stability of the application and the quality of finished packaging. If the board supplier, coating, format, line rate or logistic conditions change, process parameters may need to be re-verified.
Packaging for the food industry
Hot-melts are widely used in the production of packaging for fruit, vegetables, meat and other food products. However, this does not mean that every adhesive can be used in every package. The place of application, the possibility of contact with the product and the purpose of the entire structure are important.
If the packaging is subject to requirements related to contact with food, the selection should be based on the current declaration or other relevant documentation of the adhesive manufacturer. Documents must be related to actual use and not treated as a blanket endorsement of all processes.
Send information about the cardboard, application device, process speed and conditions of use of the packaging. We will help you define your requirements and choose a solution for testing.
Let's talk about your project